4

OPT3006

SBOS698 – OCTOBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Voltage

VDD to GND

–0.5

6

V

SDA, SCL, INT, and ADDR to GND

–0.5

6

V

Current into any pin

10

mA

Temperature

Junction

150

°C

–65

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

±500

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Operating temperature

–40

85

°C

Operating power-supply voltage

1.6

3.6

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

OPT3006

UNIT

YMF (PicoStar)

6 PINS

Junction-to-ambient thermal resistance

122.8

°C/W

Junction-to-case (top) thermal resistance

1.4

°C/W

Junction-to-board thermal resistance

34.9

°C/W

Junction-to-top characterization parameter

0.8

°C/W

Junction-to-board characterization parameter

35.3

°C/W