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TLV2376IDR Datasheet(PDF) 6 Page - Texas Instruments |
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TLV2376IDR Datasheet(HTML) 6 Page - Texas Instruments |
6 / 34 page 6 TLV376, TLV2376, TLV4376 SBOS755 – OCTOBER 2016 www.ti.com Product Folder Links: TLV376 TLV2376 TLV4376 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information: TLV376 THERMAL METRIC(1) TLV376 UNIT D (SOIC) DBV (SOT-23) 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 100.1 273.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.4 126.8 °C/W RθJB Junction-to-board thermal resistance 41.0 85.9 °C/W ψJT Junction-to-top characterization parameter 4.8 10.9 °C/W ψJB Junction-to-board characterization parameter 40.3 84.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Thermal Information: TLV2376 THERMAL METRIC(1) TLV2376 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 111.1 171.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.7 63.9 °C/W RθJB Junction-to-board thermal resistance 51.7 92.8 °C/W ψJT Junction-to-top characterization parameter 10.5 9.2 °C/W ψJB Junction-to-board characterization parameter 51.2 91.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.6 Thermal Information: TLV4376 THERMAL METRIC(1) TLV4376 UNIT PW (TSSOP) 14 PINS RθJA Junction-to-ambient thermal resistance 107.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.6 °C/W RθJB Junction-to-board thermal resistance 52.6 °C/W ψJT Junction-to-top characterization parameter 1.5 °C/W ψJB Junction-to-board characterization parameter 51.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W |
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