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TLV3541 Datasheet(PDF) 6 Page - Texas Instruments |
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TLV3541 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 35 page 6 TLV3541, TLV3542, TLV3544 SBOS756 – OCTOBER 2016 www.ti.com Product Folder Links: TLV3541 TLV3542 TLV3544 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). 6.4 Thermal Information: TLV3541 THERMAL METRIC(1) TLV3541 UNIT D (SOIC) DBV (SOT-23) 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 123.8 216.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 68.7 84.3 °C/W RθJB Junction-to-board thermal resistance 64.5 43.1 °C/W ψJT Junction-to-top characterization parameter 23.0 3.8 °C/W ψJB Junction-to-board characterization parameter 64.0 42.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). 6.5 Thermal Information: TLV3542 THERMAL METRIC(1) TLV3542 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 113.9 175.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 60.4 67.8 °C/W RθJB Junction-to-board thermal resistance 54.1 97.1 °C/W ψJT Junction-to-top characterization parameter 17.1 9.3 °C/W ψJB Junction-to-board characterization parameter 53.6 95.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). 6.6 Thermal Information: TLV3544 THERMAL METRIC(1) TLV3544 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 83.8 92.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 70.7 27.5 °C/W RθJB Junction-to-board thermal resistance 59.5 33.6 °C/W ψJT Junction-to-top characterization parameter 11.6 1.9 °C/W ψJB Junction-to-board characterization parameter 37.7 33.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W |
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