Precision Hall-Effect Angle Sensor IC

A1335

4

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

DGND

BYP

DGND

NC

VCC

NC

AGND

1

2

3

4

5

6

7

14

13

12

11

10

9

8

DGND

SA0/CS

SA1/MOSI

SCL/SCLK

SDA/MISO

SENT

ISEL

DGND_1

BYP_1

AGND_1

NC

VCC_1

ISEL_2

SENT_2

SDA_2/MISO_2

SCL_2/SCLK_2

SA1_2/MOSI_2

SA0_2/CS_2

DGND_2

DGND_1

SA0_1/CS_1

SA1_1/MOSI_1

SCL_1/SCLK_1

SDA_1/MISO_1

SENT_1

ISEL_1

VCC_2

NC

AGND_2

BYP_2

DGND_2

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

LE-14 Package

(Single SoC)

LE-24 Package

(Dual SoC)

Terminal List Table

Pin Number

LE-14

LE-24

Function

VCC_1

5

5

Device power supply and input for EEPROM writing pulses. Used

to enter/exit Manchester Serial Communication mode; serves as

programming data input once mode has been entered.

VCC_2

–

17

AGND_1

7

3

Device analog ground terminal.

AGND_2

–

15

BYP_1

2

2

Internal bypass node, connect with bypass capacitor to DGND (die 1).

BYP_2

–

14

Internal bypass node, connect with bypass capacitor to DGND (die 2).

DGND_1

1, 3, 14

1, 24

Device digital ground terminal.

DGND_2

–

12,13

ISEL_1

8

18

or SPI operation (set to logic high) (for SENT/Manchester operation set

low) (die 1)

ISEL_2

–

6

or SPI operation (set to logic high) (for SENT/Manchester operation set

low) (die 2).

NC

4, 6

4, 16

Not Connected; connect to GND for optimal ESD performance.

SA0_1/

C¯¯S¯_1

13

23

tie to DGND for 0.

SPI: Chip Select input, active low (die 1).

Manchester: LSB of the ID value for Die 1. tie to BYP for 1, to DGND

SA0_2/

C¯¯S¯_2

–

11

tie to DGND for 0.

SPI: Chip Select input, active low (die 2).

Manchester: LSB of the ID value for Die 2. tie to BYP for 1, to DGND

SA1_1/

MOSI_1

12

22

tie to DGND for 0.

SPI: Master Output/Slave Input terminal (die 1).

Manchester: MSB of the ID value for Die 1. tie to BYP for 1, to DGND

SA1_2/

MOSI_2

–

10

tie to DGND for 0.

SPI: Master Output/Slave Input terminal (die 2).

Manchester: MSB of the ID value for Die 2. tie to BYP for 1, to DGND

SCL_1/

SCLK_1

11

21

externally to 3.3 V (die 1).

SCL_2/

SCLK_2

–

9

externally to 3.3 V (die 2).

SDA_1/

MISO_1

10

20

programming data input; open drain, pull up externally to 3.3 V (die 1).

SPI: Master Input/Slave Output terminal (die 1).

SDA_2/

MISO_2

–

8

programming data input; open drain, pull up externally to 3.3 V (die 2).

SPI: Master Input/Slave Output terminal (die 2).

SENT_1

9

19

SENT transmission output terminal (die 1); Manchester output in

Manchester mode; open drain, pull-up to external supply.

SENT_2

–

7

SENT transmission output terminal (die 2); Manchester output in

Manchester mode; open drain, pull-up to external supply.

1

The number following the underscore refers to the die number in a dual SOC variant

2

For additional information, refer to the Programming Reference addendum, EEPROM Description and Programming section, regarding the

INTF register, I2CM field.