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ADP7158ACPZ-1.8-R7 Datasheet(PDF) 6 Page - Analog Devices |
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ADP7158ACPZ-1.8-R7 Datasheet(HTML) 6 Page - Analog Devices |
6 / 23 page Data Sheet ADP7158 Rev. A | Page 5 of 22 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating VIN to Ground −0.3 V to +7 V VREG to Ground −0.3 V to VIN, or +4 V (whichever is less) VOUT to Ground −0.3 V to VREG, or +4 V (whichever is less) VOUT_SENSE to Ground −0.3 V to VREG, or +4 V (whichever is less) VOUT to VOUT_SENSE ±0.3 V BYP to VOUT ±0.3 V EN to Ground −0.3 V to +7 V BYP to Ground −0.3 V to VREG, or +4 V (whichever is less) REF to Ground −0.3 V to VREG, or +4 V (whichever is less) REF_SENSE to Ground −0.3 V to +4 V Storage Temperature Range −65°C to +150°C Operational Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADP7158 can be damaged when the junction temperature limits are exceeded. Monitoring ambient tempera- ture does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction to ambient thermal resistance of the package (θJA). Calculate the maximum junction temperature (TJ) from the ambient temperature (TA) and power dissipation (PD) using the following formula: TJ = TA + (PD × θJA) Junction to ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. The junction to ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit board. See JESD51-7 and JESD51-9 for detailed information on the board construction. ΨJB is the junction to board thermal characterization parameter with units of °C/W. ΨJB of the package is based on modeling and calculation using a 4-layer board. JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths rather than a single path as in thermal resistance, θJB. Therefore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package, factors that make ΨJB more useful in real-world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the following formula: TJ = TB + (PD × ΨJB) See JESD51-8 and JESD51-12 for more detailed information about ΨJB. THERMAL RESISTANCE θJA, θJC, and ΨJB are specified for the worst case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 5. Thermal Resistance Package Type θJA θJC ΨJB Unit 10-Lead LFCSP 53.8 15.6 29.1 °C/W 8-Lead SOIC 50.4 42.3 30.1 °C/W ESD CAUTION |
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