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MIC2875-5.5YMT Datasheet(PDF) 6 Page - Microchip Technology |
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MIC2875-5.5YMT Datasheet(HTML) 6 Page - Microchip Technology |
6 / 24 page MIC2875 DS20005549A-page 6 2015 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Lead Temperature — — 260 — °C Soldering 10s Storage Temperature Range TS –65 — +150 °C — Junction Operating Temperature TJ –40 — +125 °C — Package Thermal Resistances Thermal Resistance, TDFN-22-8Ld JA — 90 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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