MC100LVEL37

www.onsemi.com

4

−40°C

25°C

85°C

Symbol

Characteristic

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

fmax

Maximum Toggle Frequency

TBD

TBD

TBD

GHz

Propagation Delay

CLK to Q/Q (Diff)

CLK to Q/Q

MR to Q

640

620

640

940

920

920

680

680

680

700

700

700

920

940

920

720

720

720

980

970

980

ps

Within-Device Skew (Note 2)

Duty Cycle Skew (Differential Configuration)

(Note 3)

50

50

50

50

50

50

ps

Cycle-to-Cycle Jitter

TBD

TBD

TBD

ps

Input Swing (Note 4)

150

1000

150

1000

150

1000

mV

Output Rise/Fall Times Q (20%−80%)

280

550

280

550

280

550

ps

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

2. Within-device skew defined as identical transitions on similar paths through a device.

3. Duty cycle skew is the difference between a TPLH and TPHL propagation delay through a device.