NUD3124

http://onsemi.com

8

PACKAGE DIMENSIONS

D

J

K

L

A

C

B S

H

G

V

3

1

2

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.1102 0.1197

2.80

3.04

INCHES

B 0.0472 0.0551

1.20

1.40

C 0.0350 0.0440

0.89

1.11

D 0.0150 0.0200

0.37

0.50

G 0.0701 0.0807

1.78

2.04

H 0.0005 0.0040

0.013

0.100

J 0.0034 0.0070

0.085

0.177

K 0.0140 0.0285

0.35

0.69

L 0.0350 0.0401

0.89

1.02

S 0.0830 0.1039

2.10

2.64

V 0.0177 0.0236

0.45

0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

4. 318−03 AND −07 OBSOLETE, NEW STANDARD

318−08.

STYLE 21:

PIN 1. GATE

2. SOURCE

3. DRAIN

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

SOT−23 (TO−236)

CASE 318−08

ISSUE AH

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079