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X66AK2G02ZBB60 Datasheet(PDF) 4 Page - Texas Instruments |
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X66AK2G02ZBB60 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 230 page 4 66AK2G02, 66AK2G01 SPRS932C – DECEMBER 2015 – REVISED NOVEMBER 2016 www.ti.com Submit Documentation Feedback Product Folder Links: 66AK2G02 66AK2G01 Device Overview Copyright © 2015–2016, Texas Instruments Incorporated – Supports Up to 64 Queues and 128 Messages – Semaphore Module With Up to 64 Independent Semaphores and 16 Masters (device cores) • EDMA With 128 (2 × 64) Channels and 1024 (2 × 512) PaRAM Entries • Keystone II System on Chip (SoC) Architecture: • Security – Supports General-Purpose (GP) and High- Secure (HS) Devices – Supports Secure Boot – Supports Customer Secondary Keys – 4KB of One-Time Programmable (OTP) ROM for Customer Keys • Power Management – Integrated Power Management Microcontroller (PMMC) Technology • Supports Primary Boot From UART, I2C, SPI, GPMC, SD or eMMC, USB Device Firmware Upgrade v1.1, PCIe®, and Ethernet Interfaces • Keystone II Debug Architecture With Integrated ARM CoreSight™ Support and Trace Capability • Operating Temperature (TJ): • –40°C to 125°C (Automotive) • –40°C to 105°C (Extended) • 0°C to 90°C (Commercial) 1.2 Applications • Industrial Communications and Controls • Automotive Audio Amplifiers • Home Audio • Professional Audio • Power Protection • Other Embedded Systems 1.3 Description 66AK2G0x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field- proven Keystone II (KS2) architecture. These devices address applications that require both DSP and ARM performance, with integration of high-speed peripheral and memory interfaces, hardware acceleration for network and cryptography functions, and high-level operating systems (HLOS) support. Similar to existing KS2-based SoC devices, the 66AK2G0x enables both the DSP and ARM cores to master all memory and peripherals in the system. This architecture facilitates maximum software flexibility where either DSP- or ARM-centric system designs can be achieved. The 66AK2G0x significantly improves device reliability by extensively implementing error correction code (ECC) in processor cores, shared memory, embedded memory in modules, and external memory interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated 66AK2G0x parts satisfy a wide range of industrial and automotive requirements. Accompanied by the new Processor SDK, the 66AK2G0x development platform enables unprecedented ease-of-use with main line open source Linux, CCS 6.x, a wide range of OS-independent device drivers, as well as TI-RTOS that enables seamless task management across processor cores. The device also features advanced debug and trace technology with the latest innovations from TI and ARM, such as system trace and seamless integration of the ARM CoreSight components. Secure boot can also be made available for anticloning and illegal software update protection. For more information about secure boot, contact your TI sales representative. Table 1-1. Device Information(1) PART NUMBER PACKAGE BODY SIZE 66AK2G02 NFBGA (625) 21.0 mm × 21.0 mm 66AK2G01 NFBGA (625) 21.0 mm × 21.0 mm (1) For more information, see Section 9, Mechanical Packaging and Orderable Information. |
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