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X66AK2G02ZBB60 Datasheet(PDF) 4 Page - Texas Instruments

Part # X66AK2G02ZBB60
Description  Multicore DSPARM KeyStone II System-on-Chip (SoC)
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

X66AK2G02ZBB60 Datasheet(HTML) 4 Page - Texas Instruments

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66AK2G02, 66AK2G01
SPRS932C – DECEMBER 2015 – REVISED NOVEMBER 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: 66AK2G02 66AK2G01
Device Overview
Copyright © 2015–2016, Texas Instruments Incorporated
– Supports Up to 64 Queues and 128
Messages
– Semaphore Module With Up to 64 Independent
Semaphores and 16 Masters (device cores)
• EDMA With 128 (2 × 64) Channels and
1024 (2 × 512) PaRAM Entries
• Keystone II System on Chip (SoC) Architecture:
• Security
– Supports General-Purpose (GP) and High-
Secure (HS) Devices
– Supports Secure Boot
– Supports Customer Secondary Keys
– 4KB of One-Time Programmable (OTP) ROM
for Customer Keys
• Power Management
– Integrated Power Management Microcontroller
(PMMC) Technology
• Supports Primary Boot From UART, I2C, SPI,
GPMC, SD or eMMC, USB Device Firmware
Upgrade v1.1, PCIe®, and Ethernet Interfaces
• Keystone II Debug Architecture With Integrated
ARM CoreSight™ Support and Trace Capability
• Operating Temperature (TJ):
• –40°C to 125°C (Automotive)
• –40°C to 105°C (Extended)
• 0°C to 90°C (Commercial)
1.2
Applications
Industrial Communications and Controls
Automotive Audio Amplifiers
Home Audio
Professional Audio
Power Protection
Other Embedded Systems
1.3
Description
66AK2G0x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field-
proven Keystone II (KS2) architecture. These devices address applications that require both DSP and
ARM performance, with integration of high-speed peripheral and memory interfaces, hardware
acceleration for network and cryptography functions, and high-level operating systems (HLOS) support.
Similar to existing KS2-based SoC devices, the 66AK2G0x enables both the DSP and ARM cores to
master all memory and peripherals in the system. This architecture facilitates maximum software flexibility
where either DSP- or ARM-centric system designs can be achieved.
The 66AK2G0x significantly improves device reliability by extensively implementing error correction code
(ECC) in processor cores, shared memory, embedded memory in modules, and external memory
interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated
66AK2G0x parts satisfy a wide range of industrial and automotive requirements.
Accompanied by the new Processor SDK, the 66AK2G0x development platform enables unprecedented
ease-of-use with main line open source Linux, CCS 6.x, a wide range of OS-independent device drivers,
as well as TI-RTOS that enables seamless task management across processor cores. The device also
features advanced debug and trace technology with the latest innovations from TI and ARM, such as
system trace and seamless integration of the ARM CoreSight components.
Secure boot can also be made available for anticloning and illegal software update protection. For more
information about secure boot, contact your TI sales representative.
Table 1-1. Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE
66AK2G02
NFBGA (625)
21.0 mm × 21.0 mm
66AK2G01
NFBGA (625)
21.0 mm × 21.0 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.


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