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ICS342MLF Datasheet(PDF) 2 Page - Integrated Circuit Systems

Part # ICS342MLF
Description  FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER
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Manufacturer  ICST [Integrated Circuit Systems]
Direct Link  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS342MLF Datasheet(HTML) 2 Page - Integrated Circuit Systems

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Field Programmable Dual Output SS VersaClock
MDS 342 F
2
Revision 090704
Integrated Circuit Systems, Inc.
525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com
ICS342
Pin Assignment
8-pin (150 mil) SOIC
Output Clock Selection Table
Pin Description
External Components
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50
Ω trace (a
commonly used trace impedance), place a 33
Ω resistor
in series with the clock line, as close to the clock output
pin as possible. The nominal impedance of the clock
output is 20
Ω.
Decoupling Capacitor
As with any high-performance mixed-signal IC, the
ICS342 must be isolated from system power supply
noise to perform optimally.
A decoupling capacitor of 0.01µF must be connected
between VDD and the PCB ground plane.
Crystal Load Capacitors
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to
ground. These capacitors are used to adjust the stray
capacitance of the board to match the nominally
required crystal load capacitance. Because load
capacitance can only be increased in this trimming
process, it is important to keep stray capacitance to a
minimum by using very short PCB traces (and no vias)
been the crystal and device. Crystal capacitors must be
connected from each of the pins X1 and X2 to ground.
The value (in pF) of these crystal caps should equal
(CL -6 pF)*2. In this equation, CL= crystal load
capacitance in pF. Example: For a crystal with a 16 pF
load capacitance, each crystal capacitor would be 20
pF [(16-6) x 2] = 20.
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1) The 0.01µF decoupling capacitor should be mounted
on the component side of the board as close to the
X1 / I C L K
VDD
GN D
PDT S
CL K 1
SE L
CL K 2
X2
1
2
3
4
8
7
6
5
SEL CLK1 (MHz)
CLK2 (MHz)
Spread
Percentage
0User
Configurable
User
Configurable
User
Configurable
1User
Configurable
User
Configurable
User
Configurable
Pin
Number
Pin
Name
Pin
Type
Pin Description
1
X1/ICLK
XI
Connect this pin to a crystal or external clock input.
2
VDD
Power
Connect to +3.3 V.
3
GND
Power
Connect to ground.
4
CLK1
Output
Clock output. Weak internal pull-down when tri-state.
5
CLK2
Output
Clock output. Weak internal pull-down when tri-state.
6
SEL
Input
Select for frequency selection on CLK1 and CLK2. Internal pull-up resistor.
7PDTS
Input
Powers down entire chip. Tri-states CLK outputs when low. Internal pull-up
resistor.
8
X2
XO
Connect this pin to a crystal, or float for clock input.


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