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XMC4400 Datasheet(PDF) 4 Page - Infineon Technologies AG |
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XMC4400 Datasheet(HTML) 4 Page - Infineon Technologies AG |
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4 / 103 page  XMC4400 XMC4000 Family Data Sheet V1.2, 2015-12 Trademarks C166™, TriCore™, XMC™ and DAVE™ are trademarks of Infineon Technologies AG. ARM ®, ARM Powered®, Cortex®, Thumb® and AMBA® are registered trademarks of ARM, Limited. XMC4400 Data Sheet Revision History: V1.2 2015-12 Previous Versions: V1.1 2014-03 V1.0 2013-10 V0.6 2012-11 Page Subjects 12 Added a section listing the packages of the different markings. 14 Added BA marking variant. 37 Added footnote explaining minimum V BAT requirements to start the hibernate domain and/or oscillation of a crystal on RTC_XTAL. 38 Changed pull device definition to System Requirement (SR) to reflect that the specified currents are defined by the characteristics of the external load/driver. 38 Added information that PORST Pull-up is identical to the pull-up on standard I/O pins. 45 Updated C AINSW, CAINTOT and RAIN parameters with improved values. 59 Added footnote on test configuration for LPAC measurement. 61 Corrected parameter name of of USB pull device (upstream port receiving) definition according to USB standard (referenced to DM instead of DP) 66 Relaxed RTC_XTAL V PPX parameter value and changed it to a system requirement. 70 Added footnote on current consumption by enabling of f CCU. 71 Added Flash endurance parameter for 64 Kbytes Physical Sector PS4 N EPS4 for devices with BA marking. many Added PG-TQFP-64-19 and PG-LQFP-100-25 package information. 97, 100 Added tables describing the differences between PG-LQFP-100-11 to PG- LQFP-100-25 as well as PG-LQFP-64-19 to PG-TQFP-64-19 packages. 102 Updated to JEDEC standard J-STD-020D for the moisture sensitivity level and added solder temperature parameter according to the same standard. Subject to Agreement on the Use of Product Information |
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