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XMC1302-T038X0032 Datasheet(PDF) 5 Page - Infineon Technologies AG

Part # XMC1302-T038X0032
Description  Microcontroller Series for Industrial Applications
Download  78 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

XMC1302-T038X0032 Datasheet(HTML) 5 Page - Infineon Technologies AG

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XMC
1300 AB-Step
XMC
1000 Family
Table of Contents
Data Sheet
5
V1.7, 2016-08
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2
Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.3
Device Type Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.4
Chip Identification Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.1
Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.2.1
Package Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.2.2
Port I/O Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.2.3
Hardware Controlled I/O Function Description . . . . . . . . . . . . . . . . . . . 26
3
Electrical Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1.1
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1.2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.1.3
Pin Reliability in Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.1.4
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.2
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.2.1
Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.2.2
Analog to Digital Converters (ADC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.2.3
Out of Range Comparator (ORC) Characteristics . . . . . . . . . . . . . . . . . 46
3.2.4
Analog Comparator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.2.5
Temperature Sensor Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.2.6
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3.2.7
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.3
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.3.1
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.3.2
Power-Up and Supply Monitoring Characteristics
. . . . . . . . . . . . . . . . 57
3.3.3
On-Chip Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
3.3.4
Serial Wire Debug Port (SW-DP) Timing . . . . . . . . . . . . . . . . . . . . . . . 61
3.3.5
SPD Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
3.3.6
Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
3.3.6.1
Synchronous Serial Interface (USIC SSC) Timing . . . . . . . . . . . . . . 63
3.3.6.2
Inter-IC (IIC) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
3.3.6.3
Inter-IC Sound (IIS) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . 68
4
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.1
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.1.1
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.2
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Table of Contents
Subject to Agreement on the Use of Product Information


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