MC74VHC1G66

www.onsemi.com

9

PACKAGE DIMENSIONS

TSOP−5

CASE 483−02

ISSUE M

0.7

0.028

1.0

0.039

mm

inches

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION A.

5. OPTIONAL CONSTRUCTION: AN ADDITIONAL

TRIMMED LEAD IS ALLOWED IN THIS LOCATION.

TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2

FROM BODY.

DIM

MIN

MAX

MILLIMETERS

A

B

C

0.90

1.10

D

0.25

0.50

G

0.95 BSC

H

0.01

0.10

J

0.10

0.26

K

0.20

0.60

M

0

10

S

2.50

3.00

12

3

54

S

A

G

B

D

H

C

J

__

0.20

5X

C AB

T

0.10

2X

2X

T

0.20

NOTE 5

C

SEATING

PLANE

0.05

K

M

DETAIL Z

DETAIL Z

TOP VIEW

SIDE VIEW

A

B

END VIEW

1.35

1.65

2.85

3.15

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