SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N0054, Rev. -

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBRF2035CT

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

0.84

V

Max. Forward Voltage Drop *

0.72

V

Max. Reverse Current at DC

condition (per leg)

1

mA

Max. Reverse Current (per

leg) *

15.0

mA

Max. Junction Capacitance

(per leg)

400

pF

Typical Series Inductance

(per leg)

Measured lead to lead 5 mm

from package body

8.0

nH

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

Screw mounting, the epoxy

body is inside the heatsink.

1500

V

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature Range

-

-55 to +150

°C

Storage Temperature Range

-

-55 to +150

°C

Maximum Thermal Resistance

Junction to Case

(per leg)

DC operation

5.0

°C/W

Approximate Weight

wt

-

2

g