NLAS323

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2

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

*0.5 to )7.0

V

DC Input Voltage

*0.5 to )7.0

V

DC Output Voltage

*0.5 to )7.0

V

DC Input Diode Current

*50

mA

DC Output Diode Current

*50

mA

DC Output Sink Current

$50

mA

DC Supply Current per Supply Pin

$100

mA

DC Ground Current per Ground Pin

$100

mA

Storage Temperature Range

*65 to )150

°C

Lead Temperature, 1 mm from Case for 10 Seconds

260

°C

Junction Temperature under Bias

)150

°C

Thermal Resistance

(Note 1)

250

°C/W

Power Dissipation in Still Air at 85

°C

250

mW

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

> 150

N/A

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

RECOMMENDED OPERATING CONDITIONS

Symbol

Characteristics

Min

Max

Unit

Positive DC Supply Voltage

2.0

5.5

V

Digital Input Voltage (Enable)

GND

5.5

V

Static or Dynamic Voltage Across an Off Switch

GND

V

Analog Input Voltage (NO, COM)

GND

V

Operating Temperature Range, All Package Types

−55

+125

°C

Input Rise or Fall Time,

(Enable Input)

0

0

100

20

ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

DEVICE JUNCTION TEMPERATURE VERSUS TIME

TO 0.1% BOND FAILURES

Junction

Temperature

5C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 2. Failure Rate vs. Time Junction Temperature

TIME, YEARS