NLX2G66

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9

PACKAGE DIMENSIONS

UDFN8 1.45x1.0, 0.35P

CASE 517BZ

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.15

0.25

D

1.45 BSC

E

1.00 BSC

e

0.35 BSC

L

0.25

0.35

L1

0.30

0.40

A B

E

D

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

A

A1

0.05 C

0.05 C

PLANE

SIDE VIEW

2X

2X

A3

BOTTOM VIEW

b

e

8X

L

7X

L1

1

4

5

8

e/2

DIMENSIONS: MILLIMETERS

0.22

7X

0.48

8X

1.18

0.53

PITCH

0.35

1

PKG

OUTLINE

0.10

B

0.05

A

C

M

M