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LM2614BTL Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LM2614BTL Datasheet(HTML) 4 Page - National Semiconductor (TI) |
4 / 16 page Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. PVIN, VDD to SGND −0.2V to +6V PGND to SGND, PVIN to VDD −0.2V to +0.2V EN, EAOUT, EANEG, SYNC/MODE to SGND −0.2V to +6V FB, SW (GND −0.2V) to (VDD +0.2V) Storage Temperature Range −45˚C to +150˚C Lead Temperature (Soldering, 10 sec.) 260˚C Junction Temperature (Note 2) −25˚C to +125˚C Minimum ESD Rating ±2kV (Human Body Model, C = 100 pF, R = 1.5 k Ω) Thermal Resistance ( θ JA) (Note 3) 140˚C/W Electrical Characteristics Specifications with standard typeface are for T A =TJ = 25˚C, and those in boldface type apply over the full Operating Tem- perature Range of T A =TJ = −25˚C to +85˚C. Unless otherwise specified, PVIN = VDD = EN = SYNC/MODE = 3.6V. Symbol Parameter Conditions Min Typ Max Units V IN Input Voltage Range PVIN = VDD = V IN (Note 4) 2.8 3.6 5.5 V V FB Feedback Voltage 1.485 1.50 1.515 V V HYST PFM Comparator Hysteresis Voltage PFM Mode (SYNC/MODE = 0V) (Note 5) 24 mV I SHDN Shutdown Supply Current VIN = 3.6V, EN = 0V 0.02 3 µA I Q1_PWM DC Bias Current into VDD SYNC/MODE = VIN FB=2V 600 725 µA I Q2_PFM SYNC/MODE = 0V FB=2V 160 195 µA R DSON (P) Pin-Pin Resistance for P FET 395 550 m Ω R DSON (N) Pin-Pin Resistance for N FET 330 500 m Ω R DSON (TC) FET Resistance Temperature Coefficient 0.5 %/C I LIM Switch Peak Current Limit (Note 6) LM2614ATL 510 690 850 mA LM2614BTL 400 690 980 V IH Logic High Input, EN, SYNC/MODE 0.95 1.3 V V IL Logic Low Input, EN, SYNC/MODE 0.4 0.80 V F SYNC SYNC/MODE Clock Frequency Range (Note 7) 500 1000 kHz F OSC Internal Oscillator Frequency LM2614ATL, PWM Mode 468 600 732 kHz LM2614BTL, PWM Mode 450 600 750 T min Minimum ON-Time of PFET Switch in PWM Mode 200 ns Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but device specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and Conditions in the Electrical Characteristics table. Typical (typ) specifications are mean or average values at 25˚C and are not guaranteed. Note 2: Thermal shutdown will occur if the junction temperature exceeds 150˚C. Note 3: Thermal resistance specified with 2 layer PCB (0.5/0.5 oz. cu). Note 4: The LM2614 is designed for mobile phone applications where turn-on after system power-up is controlled by the system controller. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds 2.8V. Note 5: The hysteresis voltage is the minimum voltage swing on the FB pin that causes the internal feedback and control circuitry to turn the internal PFET switch on and then off during PFM mode. When resistor dividers are used like in the operating circuit of Figure 4, the hysteresis at the output will be the value of the hysteresis at the feedback pin times the resistor divider ratio. In this case, 24mV (typ) x ((46.4k + 33.2k)/33.2k). Note 6: Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the voltage at the FB pin is pulled below 0.7V, the internal PFET switch turns off for 2.5µs to allow the inductor current to diminish. Note 7: SYNC driven with an external clock switching between VIN and GND. When an external clock is present at SYNC; the IC is forced to be in PWM mode at the external clock frequency. The LM2614 synchronizes to the rising edge of the external clock. www.national.com 4 |
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