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BD6971FV Datasheet(PDF) 10 Page - Rohm |
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BD6971FV Datasheet(HTML) 10 Page - Rohm |
10 / 16 page 10/12 Datasheet Datasheet BD6971FV TSZ02201-0H1H0B100150-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 28.JUL.2012 Rev.002 www.rohm.com TSZ22111・15・001 ●Power dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.25 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value measured at a specified condition. Fig.26 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board 70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). Thermal resistance θjc from IC chip joint part to the package surface part of mounting the above-mentioned same substrate is shown in the following as a reference value. *Reduce by 7.0mW/°C over 25°C (On 70.0mm x 70.0mm x 1.6mm glass epoxy board) ●I/O equivalence circuit(Resistance values are typical) 1) Power supply terminal, 2) Hall input terminals, 3) Minimum output duty setting 4) Motor output terminals, and Ground terminal Output duty controllable input terminal and Output current terminal, detecting resistor and Output current detection connecting terminal terminal 5) Reference voltage output 6) Speed pulse signal output 7) Oscillating capacitor connecting terminal, terminal terminal and Hall bias terminal OSC Vcc 1k Ω Vcc 1k Ω θja = (Tj – Ta) / P [°C/W] θjc = (Tj – Tc) / P [°C/W] Fig.25 Thermal resistance Fig.26 Thermal de-rating curve θja = (Tj – Ta) / P [°C/W] 500 750 Pd[mW] 0 25 50 75 100 125 150 Ta[° C] 250 874.7 θja=142.9 [°C/W] θjc = 40 [°C/W] (reference value) Chip surface temperature Tj[°C] Package surface temperature Tc[°C] Power consumption P[W] Ambient temperature Ta[°C] TH 1k Ω H+ H– CS Vcc 10 Ω FG Vcc OUT1 OUT2 RNF Vcc GND REF 46k Ω Vcc HB 46k Ω Vcc MIN 1k Ω Vcc 30 Ω |
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