NL17SZ125

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11

PACKAGE DIMENSIONS

UDFN6, 1x1, 0.35P

CASE 517BX

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

6X

6X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIMENSION: MILLIMETERS

RECOMMENDED

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTION

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTION

0.52

1.20

0.25

0.35

PITCH

PACKAGE

OUTLINE

1

DIM

MIN

MAX

MILLIMETERS

A

0.50

0.65

A1

0.00

0.05

A3

0.13 REF

b

0.17

0.23

D

1.00 BSC

E

1.00 BSC

e

0.35

L

0.20

0.40

L1

−−−

0.15

L3

L3

0.26

0.33

A B

E

D

BOTTOM VIEW

b

e

6X

L

6X

NOTE 3

0.08 C

PIN ONE

REFERENCE

TOP VIEW

0.08 C

A

A1

0.05 C

0.05 C

PLANE

SIDE VIEW

1

3

4

6

2X

2X

A3

DETAIL B

A

M

0.07

B

C

M

0.05

C

DETAIL A