TPS54373

SLVS455A − JANUARY 2003 − REVISED JUNE 2003

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10

Minimum Recommended Exposed

Copper Area For Powerpad. 5mm

Stencils may Require 10 Percent

Larger Area

0.2454

0.0150

0.06

0.0256

0.1700

0.1340

0.0620

0.0400

0.0400

0.0400

0.0600

0.0227

0.0600

0.1010

6 PL

∅ 0.0130

4 PL

∅ 0.0180

Connect Pin 1 to Analog Ground Plane

in This Area for Optimum Performance

Minimum Recommended Top

Side Analog Ground Area

Minimum Recommended Thermal Vias: 6

× .013 dia.

Inside Powerpad Area 4

× .018 dia. Under Device as Shown.

Additional .018 dia. Vias May be Used if Top Side Analog

Ground Area is Extended.

0.2560

Figure 11. Recommended Land Pattern for 20-Pin PWP PowerPAD

PERFORMANCE GRAPHS

Data shown is for the circuit in Figure 10 with precharge disabled (D1 and D2 removed) except for slow-start timing

Figure 12

50

55

60

65

70

75

80

85

90

95

100

0

0.5

1

1.5

2

2.5

3

3.5

VI = 5 V, VO = 2.5 V

EFFICIENCY

vs

OUTPUT CURRENT

IO − Output Current − A

VI = 3.3 V, VO = 2.5 V

Figure 13

1.77

1.78

1.79

1.8

1.81

1.82

1.83

0

0.5

1

1.5

2

2.5

3

3.5

OUTPUT VOLTAGE

vs

OUTPUT CURRENT

IO − Output Current − A

VI = 5 V

VI = 3.3 V

Figure 14

3

3.5

4

4.5

5

5.5

6

IO = 3 A

VI − Input Voltage − V

OUTPUT VOLTAGE

vs

INPUT VOLTAGE

1.77

1.78

1.79

1.8

1.81

1.82

1.83

IO = 1.5 A

IO = 0 A