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B81123C1103M Datasheet(PDF) 7 Page - TDK Electronics |
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B81123C1103M Datasheet(HTML) 7 Page - TDK Electronics |
7 / 19 page Testing and Standards Test Reference Conditions of test Performance requirements Electrical Parameters IEC 60384-14 Voltage Proof: Between terminals: 4000 V AC, 1 min Terminals and enclosure: 4000 V AC, 1 min Insulation resistance, RINS Capacitance, C Dissipation factor, tan δ Within specified limits Robustness of terminations IEC 60068-2-21 Tensile strength (test Ua1) Capacitance and tan δ within specified limits Wire diameter Tensile force 0.5 < d1 ≤ 0.8 mm 0.8 < d1 ≤ 1.25 mm 10 N 20 N Resistance to soldering heat IEC 60068-2-20, test Tb, method 1A Solder bath temperature at 260 ± 5 °C, immersion for 10 seconds ∆C/C 0 ≤ 5% tan δ within specified limits Rapid change of temperature IEC 60384-14 TA = lower category temperature TB = upper category temperature Five cycles, duration t = 30 min. No visible damage I ∆C/C 0 I ≤ 5% tan δ within specified limits Vibration IEC 60384-14 Test FC: vibration sinusoidal Displacement: 0.75 mm Accleration: 98 m/s2 Frequency: 10 Hz ... 500 Hz Test duration: 3 orthogonal axes, 2 hours each axe No visible damage Bump IEC 60384-14 Test Eb: Total 4000 bumps with 400 m/s2 mounted on PCB 6 ms duration No visible damage I ∆C/C 0 I ≤ 5% tan δ within specified limits Climatic sequence IEC 60384-14 Dry heat TB / 16 h. Damp heat cyclic, 1st cycle + 55 °C / 24h / 95% ... 100% RH Cold TA / 2h Damp heat cyclic, 5 cycles + 55 °C / 24h / 95% ... 100% rh No visible damage I ∆C/C 0 I ≤ 5% I ∆ tan δ I ≤ 0.008, C ≤ 1 µF I ∆ tan δ I > 0.005, C > 1 µF Voltage proof RINS ≥ 50% of initial limit B81123 Y1 / 500 V AC Page 7 of 19 Please read Cautions and warnings and Important notes at the end of this document. |
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