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EM68A16CBQC-18H Datasheet(PDF) 11 Page - Etron Technology, Inc.

Part # EM68A16CBQC-18H
Description  16M x 16 bit DDRII Synchronous DRAM (SDRAM)
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Manufacturer  ETRON [Etron Technology, Inc.]
Direct Link  http://www.etron.com
Logo ETRON - Etron Technology, Inc.

EM68A16CBQC-18H Datasheet(HTML) 11 Page - Etron Technology, Inc.

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EtronTech
EM68A16CBQC
Rev. 1.1
11
Jan. /2016
EMR(2)
The extended mode register (2) controls refresh related features. The default value of the extended mode
register (2) is not defined, therefore the extended mode register (2) must be written after power-up for proper
operation. The extended mode register(2) is written by asserting LOW on CS#, RAS#, CAS#, WE#, HIGH on BA1
and LOW on BA0, while controlling the states of address pins A0 ~ A12. The DDR2 SDRAM should be in all bank
precharge with CKE already HIGH prior to writing into the extended mode register (2). The mode register set
command cycle time (tMRD) must be satisfied to complete the write operation to the extended mode register (2).
Mode register contents can be changed using the same command and clock cycle requirements during normal
operation as long as all banks are in the precharge state.
Table 7. Extended Mode Register EMR (2) Bitmap
BA1 BA0 A12 A11 A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0 Address Field
1
0
0
*1
SRF
0
*1
DCC
PASR
*3
Extended Mode Register(2)
A7
High Temperature Self-Refresh Rate Enable
0
Disable
1
Enable
*2
BA1 BA0
MRS mode
A3
DCC Enable
*4
0
0
MR
0
Disable
0
1
EMR(1)
1
Enable
1
0
EMR(2)
1
1
EMR(3)
A2
A1
A0 Partial Array Self Refresh for 4 Banks
0
0
0
Full array
0
0
1
Half Array (BA[1:0]=00&01)
0
1
0
Quarter Array (BA[1:0]=00)
0
1
1
Not defined
1
0
0
3/4 array (BA[1:0]=01,10&11)
1
0
1
Half array (BA[1:0]=10&11)
1
1
0
Quarter array (BA[1:0]=11)
1
1
1
Not defined
NOTE 1:
The rest bits in EMRS(2) are reserved for future use and all bits in EMRS(2) except A0-A2, A7, BA0 and BA1 must
be programmed to 0 when setting the extended mode register(2) during initialization.
NOTE 2:
Due to the migration nature, user needs to ensure the DRAM part supports higher than 85℃ Tcase temperature
self-refresh entry. If the high temperature self-refresh mode is supported then controller can set the EMRS2[A7] bit
to enable the self-refresh rate in case of higher than 85℃ temperature self-refresh operation.
NOTE 3:
If PASR (Partial Array Self Refresh) is enabled, data located in areas of the array beyond the specified location will
be lost if self refresh is entered. Data integrity will be maintained if tREF conditions are met and no Self Refresh
command is issued.
NOTE 4:
DCC (Duty Cycle Corrector) implemented, user may be given the controllability of DCC thru EMR (2) [A3] bit.


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