IPD50R3K0CE datasheet(3/14 Pages) INFINEON

Part #	IPD50R3K0CE

Description	500V CoolMOS짧 CE Power Transistor

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Manufacturer	INFINEON [Infineon Technologies AG]

Direct Link	http://www.infineon.com

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3 / 14 page

3

500VCoolMOSªCEPowerTransistor

IPD50R3K0CE,IPU50R3K0CE

Rev.2.3,2016-06-13

Final Data Sheet

1Maximumratings

atTj=25°C,unlessotherwisespecified

Table2Maximumratings

Values

Min.

Typ.

Max.

Parameter

Symbol

Unit Note/TestCondition

Continuous drain current

1)

ID

-

2.6

1.6

A

TC = 25°C

TC = 100°C

Pulsed drain current

2)

ID,pulse

-

4.1

A

TC=25°C

Avalanche energy, single pulse

EAS

-

18

mJ

ID =0.5A; VDD = 50V

Avalanche energy, repetitive

EAR

-

0.03

mJ

ID =0.5A; VDD = 50V

Avalanche current, repetitive

IAR

-

0.5

A

-

MOSFET dv/dt ruggedness

dv/dt

-

50

V/ns

VDS=0...400V

Gate source voltage

VGS

-20

-30

-

20

30

V

static;

AC (f>1 Hz)

Power dissipation (non FullPAK)

TO-252, TO-251

Ptot

-

26

W

TC=25°C

Operating and storage temperature

Tj,Tstg

-55

-

150

°C

-

Continuous diode forward current

IS

-

1.8

A

TC=25°C

Diode pulse current

2)

IS,pulse

-

4.1

A

TC = 25°C

Reverse diode dv/dt

3)

dv/dt

-

15

V/ns

VDS=0...400V,ISD<=IS,Tj=25°C,

tcond<2

µs

Maximum diode commutation speed

3)

dif/dt

-

500

A/

µs VDS=0...400V,ISD<=IS,Tj=25°C,

tcond<2

µs

2Thermalcharacteristics

Table3ThermalcharacteristicsDPAK,IPAK

Values

Min.

Typ.

Max.

Parameter

Symbol

Unit Note/TestCondition

Thermal resistance, junction - case

RthJC

-

4.85

°C/W -

Thermal resistance, junction - ambient

4)

RthJA

-

35

62

-

°C/W

SMD version, device on PCB,

minimal footprint

SMD version, device on PCB, 6cm

2

cooling area

4)

Soldering temperature, wave- &

reflowsoldering allowed

Tsold

-

260

°C

reflow MSL 1

1) Limited by Tj max. Maximum duty cycle D=0.5

2) Pulse width tp limited by Tj,max

3)VDClink=400V;VDS,peak<V(BR)DSS;identicallowsideandhighsideswitchwithidenticalRG

4) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm2 copper area (thickness 70

µm) for drain connection. PCB

is vertical without air stream cooling.

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