7

Ceramic-Package Modules

Structure of a ceramic-package module (transceiving unit)

The TOSLINK product line includes several ceramic-package modules, which have higher reliability levels

than modules in molded-resin packages.

In these modules the LED, photodiode, transmission IC, receiving IC and chip capacitors are all mounted on a

ceramic substrate and hermetically sealed in metal shells.

These ceramic-package modules are used in applications requiring high levels of reliability.

The optical transceiving units used in optical modules have the following

structure as shown in the figure on the right.

The LED, the transmitting IC which drives the LED and the chip capacitor

are mounted on a ceramic substrate.

In this particular unit the photodiode, the receiving IC (which features a

waveform-reshaping function) and the chip capacitors are also mounted on

the same ceramic substrate.

These devices are hermetically sealed in metal shells with glass windows.

TODX283 – high-speed optical module compatible with PN-type connectors

The TODX283 is a ceramic-package transceiving module which can be used

with either an APF (all-plastic fiber) or a PCF (plastic-cladding silica-fiber)

cable.

Just like a general-purpose optical module, this product incorporates a

transmitting IC which drives an LED, and an on-chip receiving IC with a

waveform-reshaping function. It is easy to connect this module to peripheral

circuits, since its input and output are both TTL-level.

This module is compatible with PN-type connectors and JIS F7-type fiber-

optic connectors.

Main Specifications of the TODX283

Data rate: DC to 50 Mb/s (NRZ code)

Transmission distance: 10 m (max) (via APF cable)

100 m (max) (via PCF cable)

Pulse width distortion: less than

±7 ns

Center wavelength: 650nm

Operating temperature: –10

°C to 70°C

TTL interface

Structure of ceramic-package

transceiver unit

External appearance of optical

tranceiving module TODX283

Ceramic-package transceiving module (TODX283)

Ceramic

substrate

Bonding

pad

Transmission

IC

LED

Capacitor

Photodetector

Receiving

IC

Lead

pin

Metal

shell

Glass window