AT28HC256

11

t

ACC

(ns)

Ordering Code

Package

Operation Range

Active

Standby

70

80

60

AT28HC256(E,F)-70JC

AT28HC256(E,F)-70PC

32J

28P6

Commercial

(0

°C to 70°C)

0.3

AT28HC256(E,F)-70JI

AT28HC256(E,F)-70PI

32J

28P6

Industrial

(-40

°C to 85°C)

90

80

0.3

AT28HC256(E,F)-90JC

AT28HC256(E,F)-90PC

32J

28P6

Commercial

(0

°C to 70°C)

AT28HC256(E,F)-90JI

AT28HC256(E,F)-90PI

32J

28P6

Industrial

(-40

°C to 85°C)

80

0.3

AT28HC256(E,F)-90DM/883

AT28HC256(E,F)-90FM/883

AT28HC256(E,F)-90LM/883

AT28HC256(E,F)-90UM/883

28D6

28F

32L

28U

Military/883C

Class B, Fully Compliant

(-55

°C to 125°C)

120

80

0.3

AT28HC256(E,F)-12JC

AT28HC256(E,F)-12PC

AT28HC256(E,F)-12SC

AT28HC256(E,F)-12TC

32J

28P6

28S

28T

Commercial

(0

°C to 70°C)

80

0.3

AT28HC256(E,F)-12JI

AT28HC256(E,F)-12PI

AT28HC256(E,F)-12SI

AT28HC256(E,F)-12TI

32J

28P6

28S

28T

Industrial

(-40

°C to 85°C)

80

0.3

AT28HC256(E,F)-12DM/883

AT28HC256(E,F)-12FM/883

AT28HC256(E,F)-12LM/883

AT28HC256(E,F)-12UM/883

28D6

28F

32L

28U

Military/883C

Class B, Fully Compliant

(-55

°C to 125°C)

Package Type

28D6

28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip)

28F

28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)

32J

32-Lead, Plastic J-Leaded Chip Carrier (PLCC)

32L

32-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)

28P6

28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

28S

28-Lead, 0.300" Wide Plastic Gull Wing Small Outline (SOIC)

28T

28-Lead, Plastic Thin Small Outline Package (TSOP)

28U

28-Pin, Ceramic Pin Grid Array (PGA)

W

Die

Options

Blank

Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms

E

High Endurance Option: Endurance = 100K Write Cycles

F

Fast Write Option: Write Time = 3 ms