LED Data Sheet - SECK1FB0EY-DA

● Attention after opened

The LED is in SMD package. When the LED is mounted by means of soldering and the resin

is unusually damp, soldering may cause interfacial defoliation.

This occurs when a drastic temperature change causes moisture in the resin to evaporate and

to swell. Therefore, attention to the below must be paid. 　

①　Atmosphere when using the LEDs after package is opened

After opened and mounted, soldering should be carried out quickly.

Following atmosphere is recommended when using (and mounting) the LEDs.

Temperature : 5～30℃

Humidity : less than 70%

②　Baking

In case 168 hours have passed after package is opened, LEDs must be dried as follows.

60±5 ℃ for more than 24 hours (taping reel)

③　Storage after package is opened

Following storage conditions are recommended after package is opened.

In case indicator color (blue) of desiccant (ex. silica gel) has disappeared,

LEDs must be dried under the same conditions as ② above.

● Other

①　After soldering any mechanical force or excessive vibration should not be applied to LEDs during

cooling process until the LEDs cool down to normal temperature.

②　Quick cooling must be avoided.

③　The LEDs should not be mounted on warped direction of PCB.

④　This product series emits high light power. Do not look directly into the light emitting area.

Direct exposure to the light over an extended time period may harm eyes.

⑤　Extra attention should be paid to the sealing resin of the product, which is silicone resin.

・The emitting area of the LEDs contains fine gold wires. Touching this area witout care may

add excess stress on the internal gold wires and may result in

・The silver plating of the leadframe may discolor if the product comes into contact with material

　containing sulfides or if it is exposed to an atmosphere containing sulfide gas.

　　　　SANKEN ELECTRIC COMPANY, LTD.

Page 7 / 12