NLSX3013

www.onsemi.com

10

PACKAGE DIMENSIONS

20 PIN FLIP−CHIP CSP, 2.54x2.03, 0.5P

CASE 766AK

ISSUE A

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

---

MILLIMETERS

A1

A2

D

2.54 BSC

E

b

0.29

0.34

e

0.50 BSC

D1

1.50 BSC

E1

2.00 BSC

0.66

A B

PIN A1

REFERENCE

D1

E1

e/2

A

0.05

B

C

0.03 C

0.05 C

20X

b

12

3

4

5

D

C

B

A

0.10 C

A

A1

A2

C

0.21

0.27

2.03 BSC

0.10 C

2X

20X

NOTE 3

BOTTOM VIEW

SIDE VIEW

TOP VIEW

0.33

0.39

20X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIMENSION: MILLIMETERS

RECOMMENDED

0.25

A1

0.50

PITCH

0.50

PITCH

PACKAGE

OUTLINE

D

E

e

PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

NLSX3013/D

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