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SN65DSI84TPAPRQ1 Datasheet(PDF) 6 Page - Texas Instruments

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Part # SN65DSI84TPAPRQ1
Description  Automotive Single-Channel MIPI DSI to Dual-Link LVDS Bridge
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN65DSI84TPAPRQ1 Datasheet(HTML) 6 Page - Texas Instruments

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SN65DSI84-Q1
SLLSEW9 – DECEMBER 2016
www.ti.com
Product Folder Links: SN65DSI84-Q1
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Copyright © 2016, Texas Instruments Incorporated
(1)
The unit interval (UI) is one half of the period of the HS clock; at 500 MHz the minimum setup and hold time is 150 ps.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
VCC
VCC power supply
1.65
1.8
1.95
V
VPSN
Supply noise on any VCC pin
ƒ(noise) > 1 MHz
0.05
V
V(DSI)
DSI input pin voltage
–50
1350
mV
ƒ(I2C)
Local I2C input frequency
400
kHz
ƒHS(CLK)
DSI high-speed (HS) clock input frequency
40
500
MHz
tsu
DSI HS data to clock setup time
0.15
UI(1)
th
DSI HS data to clock hold time
0.15
UI(1)
ZOD(LVDS)
LVDS output differential impedance
90
132
Ω
TC
Case temperature
92.2
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
SN65DSI84-Q1
UNIT
PAP (HTQFP)
64 PINS
RθJA
Junction-to-ambient thermal resistance
36.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
18.2
°C/W
RθJB
Junction-to-board thermal resistance
20.6
°C/W
ψJT
Junction-to-top characterization parameter
0.8
°C/W
ψJB
Junction-to-board characterization parameter
20.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.2
°C/W
(1)
All typical values are at VCC = 1.8V and TA = 25°C
(2)
SN65DSI84-Q1: SINGLE Channel DSI to DUAL Channel LVDS, 1400 x 900
(a) number of LVDS lanes = 2 × (3 data lanes + 1 CLK lane)
(b) number of DSI lanes = 2 data lanes + 1 CLK lane
(c) LVDS CLK OUT = 53.25 M
(d) DSI CLK = 500 M
(e) RGB888, LVDS18 bpp
Maximum values are at VCC = 1.95 V and TA = 105°C
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX
UNIT
VIL
Low-level control signal input voltage
0.3 × VCC
V
VIH
High-level control signal input voltage
0.7 × VCC
V
VOH
High-level output voltage
IOH = –4 mA
1.25
V
VOL
Low-level output voltage
IOL = 4 mA
0.4
V
ILKG
Input failsafe leakage current
VCC = 0; VCC(PIN) = 1.8 V
±30
μA
IIH
High level input current
Any input terminal
±30
μA
IIL
Low level input current
Any input terminal
±30
μA
IOZ
High-impedance output current
CMOS output terminals
±10
μA
IOS
Short-circuit output current
Any output driving GND short
±50
mA
ICC
Device active current
See (2)
106
164
mA
IULPS
Device standby current
All data and clock lanes are in ultra-low
power state (ULPS)
7.7
14
mA
IRST
Shutdown current
EN = 0
0.04
130
µA
REN
EN control input resistor
200


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