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LMR23625-Q1

SNVSAR5 – DECEMBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

In shutdown mode, the VCC to AGND maximum value is 5.25 V.

7 Specifications

7.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted)

(1)

PARAMETER

MIN

MAX

UNIT

Input Voltages

VIN to PGND

-0.3

42

V

EN/SYNC to AGND

-5.5

VIN + 0.3

FB to AGND

-0.3

4.5

PGOOD to AGND

-0.3

15

AGND to PGND

-0.3

0.3

Output Voltages

SW to PGND

-1

VIN + 0.3

V

SW to PGND less than 10 ns transients

-5

42

BOOT to SW

-0.3

5.5

VCC to AGND

-0.3

Junction temperature

-40

150

°C

Storage temperature

-65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2500

V

Charged-device model (CDM)

±1000

(1)

Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits.

For guaranteed specifications, see Electrical Characteristics.

7.3 Recommended Operating Conditions

Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input Voltage

VIN

4

36

V

EN/SYNC

-5

36

FB

-0.3

1.2

PGOOD

-0.3

12

Input Current

PGOOD pin current

0

1

mA

Output Voltage

1

28

V

Output Current

0

2.5

A

Temperature

-40

125

°C