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LM2937 Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LM2937 Datasheet(HTML) 4 Page - National Semiconductor (TI) |
4 / 11 page Electrical Characteristics V IN =VNOM + 5V, (Note 4) IOUTmax = 500 mA for the TO-220 and TO-263 packages, IOUTmax=400mA for the SOT-223 pack- age, C OUT = 10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the indicted device., all other specifications are for T A =TJ = 25˚C. Output Voltage (V OUT) 12V 15V Units Parameter Conditions Typ Limit Typ Limit Output Voltage 5 mA ≤ I OUT ≤ IOUTmax 11.64 14.55 V (Min) 12.00 11.40 15.00 14.25 V(Min) 12.36 15.45 V(Max) 12.60 15.75 V(Max) Line Regulation (V OUT + 2V) ≤ VIN ≤ 26V, 36 120 45 150 mV(Max) I OUT =5 mA Load Regulation 5 mA ≤ I OUT ≤ IOUTmax 12 120 15 150 mV(Max) Quiescent Current (V OUT + 2V) ≤ VIN ≤ 26V, 2 10 2 10 mA(Max) I OUT =5 mA V IN =(VOUT + 5V), 10 20 10 20 mA(Max) I OUT =IOUTmax Output Noise 10 Hz–100 kHz, 360 450 µVrms Voltage I OUT =5 mA Long Term Stability 1000 Hrs. 44 56 mV Dropout Voltage I OUT =IOUTmax 0.5 1.0 0.5 1.0 V(Max) I OUT = 50 mA 110 250 110 250 mV(Max) Short-Circuit Current 1.0 0.6 1.0 0.6 A(Min) Peak Line Transient t f < 100 ms, RL = 100Ω 75 60 75 60 V(Min) Voltage Maximum Operational 26 26 V(Min) Input Voltage Reverse DC V OUT ≥ −0.6V, RL = 100Ω −30 −15 −30 −15 V(Min) Input Voltage Reverse Transient t r < 1 ms, RL = 100Ω −75 −50 −75 −50 V(Min) Input Voltage Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its rated Operating Conditions. Note 2: The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for op- eration, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125˚C and the electrical specifications do not apply. If the die temperature rises above 150˚C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65˚C/W, for the TO-220 package, 73˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the LM2937 junction-to-case thermal resistance θJC of 3˚C/W and the heatsink case-to-ambient thermal resistance. If the TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application Hints for more information on heatsinking). Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 k Ω. Note 4: Typicals are at TJ = 25˚C and represent the most likely parametric norm. www.national.com 4 |
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