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C220-075 Datasheet(PDF) 1 Page - Ohmite Mfg. Co. |
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C220-075 Datasheet(HTML) 1 Page - Ohmite Mfg. Co. |
1 / 2 page 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 168 Surface Heatsink Area Weight Length “L” Part Number (in2/mm2) (oz/g) (mm) C247-025 11 / 7,312 0.5 / 15 25 C247-050 23 / 14,858 1.1 / 31 50 C247-075 34 / 21,655 1.6 / 45 75 C264-030 13 / 8,774 0.7 / 19 30 C264-058 25 / 16,963 1.35 / 37 58 C264-085 37 / 24,861 1.97 / 54 85 C220-025 11 / 7,312 0.5 / 15 25 C220-050 23 / 14,858 1.1 / 31 50 C220-075 34 / 21,655 1.6 / 45 75 C126-025 10.2 / 6,559 0.45 / 12.7 25 C126-040 16.3 / 10,495 0.72 / 20.3 40 C126-050 20.4 / 13,119 0.90 / 25.4 50 C126-075 30.6 / 21,655 1.35 / 38.1 75 Ohmite introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264 devices. This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling. FEA TURES •MinimumassemblycostandlaborSpringClips make the mounting holes, fasteners, tools and fixtures obsolete in assembly operations & reduce costs. •MaximumThermalTransferMaximumsurfacearea per unit volume, efficient cooling fins & consistent mounting force reduces thermal resistance. •MaximumRepeatabilityConstantspringforceover repeated assembly/disassembly. •MaximumReliabilityResilientspringactionlocks electronic component in place. Fewer parts in assembly and no fasteners and washers required. Prevent short circuit by eliminating metal particles generated from hardware or thread tapping. •DesignFlexibilityMaximumflexibilityfordynamic device locations and power upgrading. “Configure- to-Fit” gives designers total freedom to configure heat sink needed to fit into a multitude design envi- ronments. C Series TO-126, TO-247, TO-220 and TO-264 Package Heatsinks C h ARACTER i ST i CS Heat Sink Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anod- ized finish. Spring Clip Music Wire, Per ASTM A228 with bright nickel plating Solder Foot Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS compliant. Interface Thermal Resistance for improvement, use thermal joint compound, 0.005 Grafoil (TGon 800 by Laird), or phase change material (Hi-Flow by Bergquist) Insulato r (Optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist SER i ES SPEC i F i CAT i ONS hEAT Di SS i P AT i ON Heat Dissipated, total for ALL devices (watts) 120 80 0 510 100 15 0 140 2 1 0 3 8 7 9 600 200 400 1000 60 40 20 5 6 4 Air Velocity (ft./min.) 800 C247-025-1AE (1 device) C247-050-2AE (2 devices) C247-075-3AE (3 devices) HeatdissipationisthetotalforALLDEVICESattachedtoheatsink. Total Heat Dissipated (watts) 36 32 22 6 7 8 9 10 34 2 3 4 5 38 12 10 600 200 400 1000 30 28 24 26 6 8 4 Air Velocity (ft./min.) 800 TO-126/CE-S102 (25mm long) one device w/Sil-pad 900s (continued) |
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