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EMIF02-02OABRY Datasheet(PDF) 9 Page - STMicroelectronics |
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EMIF02-02OABRY Datasheet(HTML) 9 Page - STMicroelectronics |
9 / 11 page DocID029487 Rev 1 9/11 EMIF02-02OABRY Recommendation on PCB assembly 11 3 Recommendation on PCB assembly 3.1 Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-ST-020. 3.2 Stencil opening design Figure 15. Recommended stencil window position in mm (inches) |
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