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HI8445PSTF Datasheet(PDF) 9 Page - Holt Integrated Circuits |
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HI8445PSTF Datasheet(HTML) 9 Page - Holt Integrated Circuits |
9 / 9 page HI-8444, HI-8445, HI-8448 PACKAGE DIMENSIONS HOLT INTEGRATED CIRCUITS 9 millimeters (inches) Package Type: 38HS BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 38-PIN PLASTIC TSSOP 0° to 8° Pin 1 0.220 ± 0.050 (0.0087 ± 0.002) 9.700 ± 0.100 (0.382 ± 0.004) 4.400 ± 0.100 (0.173 ± 0.004) 0.145 ± 0.055 (0.006 ± 0.002) 0.925 ± 0.125 (0.036 ± 0.005) 0.100 ± 0.050 (0.004 ± 0.002) 0.600 ± 0.150 (0.024 ) ± 0.006 6.400 ± 0.150 (0.252 ) ± 0.006 Detail A See Detail A 0.500 (0.0197) BSC 44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN) Package Type: 44PCS BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 5.50 ± 0.050 (0.217 ± 0.002) 0.400 ± 0.050 (0.016 ± 0.002) 0.25 ± 0.050 (0.010 ) ± 0.002 0.50 (0.0197) 0.200 (0.008) 1.00 (0.039) 7.00 (0.276) BSC 5.50 ± 0.050 (0.217 ± 0.002) typ Bottom View Top View BSC 7.00 (0.276) BSC max millimeters (inches) Electrically isolated heat sink pad on bottom of package Connect to any ground or power plane for optimum thermal dissipation |
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