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3 - 121

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

MxN Spurious Outputs

nLO

mRF

0

1234

0

xx

-12

xx

xx

xx

1

47

0

53

xx

xx

2xx

62

68

59

xx

3xx

xx

101

70

90

4

xxxxxx

90

104

RF = 35.1 GHz @ -10 dBm

LO = 35 GHz @ +17 dBm

Data taken without IF hybrid

All values in dBc below IF power level

Absolute Maximum Ratings

RF Input

+19 dBm

IF1 / IF2 Input

+24 dBm

LO Drive

+27 dBm

Channel Temperature

150°C

Continuous Pdiss (T=85°C)

(derate 8.95 mW/°C above 85°C)

582 mW

Thermal Resistance (R

TH

)

(channel to die bottom)

111.6 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

ESD Sensitivity (HBM)

Class 1A

Outline Drawing

Standard

Alternate

WP-3 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC555

GaAs MMIC I/Q MIXER

31 - 38 GHz

v02.0907

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004”

4. BACKSIDE METALIZATION: GOLD

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. CONNECTION NOT REQUIRED FOR

UNLABELED BOND PADS.

8. OVERALL DIE SIZE ±.002”

9. THIS DIE IS DESIGNED FOR PICK-UP WITH

VACUUM (EDGE) COLLET TOOLS. TO PRECLUDE

THE RISK OF PERMANENT DAMAGE, NO CONTACT

TO THE DIE SURFACE IS ALLOWED WITHIN THIS

RECTANGULAR AREA.