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MLX90819LUFEBB-000WB Datasheet(PDF) 9 Page - Melexis Microelectronic Systems |
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MLX90819LUFEBB-000WB Datasheet(HTML) 9 Page - Melexis Microelectronic Systems |
9 / 11 page MLX90819 Datasheet Page 9 of 11 REVISION 3 – OCTOBER 20, 2016 3901090819 Vdd Gnd SENTOut (TX) MLX90819 in SENT mode 47nF 2.2nF Figure 5: MLX90819 application schematic - SENT 12. Die Dimensions The MLX90819 shall be delivered as bare die, on fully tested wafers. Each wafer is accompanied by a wafer map in order to discriminate between good and bad die during customer assembly. The die dimensions (including scribe lane), membrane size are depicted in Figure 6. All dimensions are in mm. Figure 6: Floorplan of a single die, including central position of membrane 2.555 ± 0.05 2.555 ± 0.05 TYP < 0.1 TYP < 0.1 TYP 0.780 1 .05 ± 0.05 TYP 0.55 TYP 0.5 1.09 ±0.08 0.8 ±0.08 Die Dimension excluding scribe lane Die Dimension including scribe lane (after dicing) |
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