MLX90819

Datasheet

Page 9 of 11

REVISION 3 – OCTOBER 20, 2016

3901090819

Vdd

Gnd

SENTOut

(TX)

MLX90819 in SENT mode

47nF

2.2nF

Figure 5: MLX90819 application schematic - SENT

12. Die Dimensions

The MLX90819 shall be delivered as bare die, on fully tested wafers. Each wafer is accompanied by a wafer map in order to

discriminate between good and bad die during customer assembly. The die dimensions (including scribe lane), membrane

size are depicted in Figure 6. All dimensions are in mm.

Figure 6: Floorplan of a single die, including central position of membrane

2.555

± 0.05

2.555 ± 0.05

TYP < 0.1

TYP < 0.1

TYP

0.780

1 .05

± 0.05

TYP 0.55

TYP 0.5

1.09

0.8

±0.08

Die Dimension excluding scribe lane

Die Dimension including scribe lane (after dicing)