MC74HC157A

http://onsemi.com

5

EXPANDED LOGIC DIAGRAM

4

7

9

12

2

3

5

6

11

10

14

13

15

1

A0

B0

A1

B1

A2

B2

A3

B3

Y0

Y1

Y2

Y3

OUTPUT ENABLE

SELECT

DATA

OUTPUTS

NIBBLE

OUTPUTS

ORDERING INFORMATION

Device

Package

MC74HC157ADG

SOIC−16

(Pb−Free)

48 Units / Rail

MC74HC157ADR2G

SOIC−16

(Pb−Free)

2500 / Tape & Reel

MC74HC157ADTR2G

TSSOP−16

(Pb−Free)

2500 / Tape & Reel

NLV74HC157ADR2G*

SOIC−16

(Pb−Free)

2500 / Tape & Reel

NLV74HC157ADTR2G*

TSSOP−16

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable