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MLX90366LVSADU253RE Datasheet(PDF) 3 Page - Melexis Microelectronic Systems

Part # MLX90366LVSADU253RE
Description  Triaxis횘 Position Sensor IC feat. SENT
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Manufacturer  MELEXIS [Melexis Microelectronic Systems]
Direct Link  http://www.melexis.com
Logo MELEXIS - Melexis Microelectronic Systems

MLX90366LVSADU253RE Datasheet(HTML) 3 Page - Melexis Microelectronic Systems

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MLX90366
Triaxis
®
®
®
® Position Sensor IC feat. SENT
MLX90366
Page 3 of 34
Datasheet
Rev 1.2
09/11/2015
2. Description
The MLX90366 Triaxis® Position Sensor Assembly is a high accuracy linear and angular position sensor
which eliminates need for inclusion of a printed circuit board (PCB) within sensing modules.
This device is based on a Dual Mold Package (DMP) construction, which integrates a Triaxis position
sensing die together with the decoupling capacitors necessary to meet the strenuous ESD and EMC
requirements. No PCB is needed.
The Triaxis position sensing die is nothing but the one used for the MLX90367 in conventional surface-
mount packages (SOIC-8 – single die & TSSOP-16 – dual die).
The decoupling capacitors are X8R capacitors well suited for package integration and the target operating
temperature range.
The MLX90366 is sensitive to the three components of the flux density applied to the IC (i.e. BX, BY and
BZ). This allows the MLX90366 with the correct magnetic circuit to decode the absolute position of any
moving magnet (e.g. rotary position from 0 to 360 Degrees or linear displacement, stroke - Figure 2). It
enables the design of novel generation of non-contacting position sensors that are frequently required for
both automotive and industrial applications.
MLX90366 provides SENT Frames encoded according the Secure Sensor format.
The circuit delivers enhanced serial messages providing error codes, and user-defined values.
MLX90366 Triaxis® Position Sensor Assembly enables the realization of position sensor modules for
which a PCB is no longer needed: this yield to an increase of the electrical, mechanical and environmental
robustness of the final application.


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