Thermal Shock Test

MIL-STD-202

METHOD 107

3

2

1

Total:100 cycles

Step

Conditions for 1 cycle.

Room Temperature

85+5

-55±2

30±3

30±3

Temperature (°C)

Times (min.)

Within5

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 5

7. RELIABILITY AND TEST CONDITION:

Humidity Test

Solderability Test

Resistance to Soldering

Humidity : 90-95%

Time : 500±8 hrs

Temperature : 40±2°C

Time: 10±1.0 Sec

Temp.: 260±5°C

Refer to standard electrical characteristics list

PERFORMANCE

Electrical Characteristics Test

Inductance L

ITEM

Agilent-4291, Agilent-4287

Agilent-4291

TEST CONDITION

1. Inductors shall be no evidence of electrical and

to drop approximately

L(%).

△

Saturation DC Current (Isat) will cause L0

Agilent-4338

Measured at room temperature after placing for 2 to 3hrs

Heat

Base on temp. rise &

L/L0A 30%.

△≦

Q

SRF

DC Resistance

Rated Current

rise approximately

T(°C) without core loss.

△

Heat Rated Current (Irms) will cause the coil temperature

ΔT 40°CMax

Temperature Rise Test

1.Applied the allowed DC current.

2.Temperature measured by digital surface thermometer

Mechanical Performance Test

MIL-STD-202

METHOD 210

mechanical damage.

2. Inductance : within ±10% of initial value

ANSI/J-STD-002

More than 95% of terminal electrode should be

covered with solder.

bath at 235±5°C for 4±1seconds.

After fluxing,component shall be dipped in a melted solder

150°C

4±1.0

seconds

60

seconds

Preheating

235°C

Dipping

Natural

cooling

Reliability Test

MIL-STD-202

METHOD 103

1.Visual examination：No mechanical damage

2.Inductance：within±10% of initial value

Measured at room temperature after placing for 2 to 3 hrs

SMD Power Inductors (RoHS Compliant)

NOTE : Specifications subject to change without notice. Please check our website for latest information.

15.08.2013

SPS201610H SERIES