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INA1650IPWR Datasheet(PDF) 4 Page - Texas Instruments |
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INA1650IPWR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 39 page 4 INA1650 SBOS818 – DECEMBER 2016 www.ti.com Product Folder Links: INA1650 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to VS / 2 (ground in symmetrical dual supply setups), one amplifier per package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage Supply voltage, VS = (V+) – (V–) 40 V Input voltage (Signal inputs, enable, ground) (V–) – 0.5 (V+) + 0.5 Input differential voltage (V+) – (V–) Current Input current (all pins except power-supply pins) ±10 mA Output short-circuit(2) Continuous Temperature Operating, TA –55 125 °C Junction, TJ 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage (V+ – V–) 4.5 (±2.25) 36 (±18) V Specified temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) INA1650 UNIT PW (TSSOP) 14 PINS RθJA Junction-to-ambient thermal resistance 97.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 22.6 °C/W RθJB Junction-to-board thermal resistance 40.4 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 39.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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