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TPS54824RNVT Datasheet(PDF) 4 Page - Texas Instruments |
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TPS54824RNVT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 38 page 4 TPS54824 SLVSDC9 – NOVEMBER 2016 www.ti.com Product Folder Links: TPS54824 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage VIN –0.3 18 V BOOT –0.3 25 BOOT (10 ns transient) –0.3 27 BOOT (vs SW) –0.3 6.5 SW –1 19 SW (10 ns transient) –3 21 EN, SS/TRK, PGOOD, RT/CLK, FB, COMP –0.3 6.5 Operating Junction Temperature Range, TJ -40 150 °C Storage Temperature Range, TSTG -55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Parameter MIN NOM MAX UNIT VIN Input voltage range 4.5 17 V VOUT Output Voltage 0.6 12 V IOUT Output current 8 A TJ Operating junction temperature -40 150 °C fSW Switching Frequency (RT mode and PLL mode) 200 1600 kHz (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) TPS54824 UNIT RNV 18 PINS ThetaJA Junction-to-ambient thermal resistance JEDEC 57.1 °C/W ThetaJA Junction-to-ambient thermal resistance EVM 34 °C/W ThetaJCtop Junction-to-case (top) thermal resistance 26.3 °C/W ThetaJB Junction-to-board thermal resistance 18.8 °C/W PsiJT Junction-to-top characterization parameter 0.8 °C/W PsiJB Junction-to-board characterization parameter 18.8 °C/W ThetaJCbot Junction-to-case (bottom) thermal resistance 1.2 °C/W |
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