4

TPS54824

SLVSDC9 – NOVEMBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

VIN

–0.3

18

V

BOOT

–0.3

25

BOOT (10 ns transient)

–0.3

27

BOOT (vs SW)

–0.3

6.5

SW

–1

19

SW (10 ns transient)

–3

21

EN, SS/TRK, PGOOD, RT/CLK, FB, COMP

–0.3

6.5

-40

150

°C

-55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per

±2000

V

Charged device model (CDM), per

JEDEC specification JESD22-C101, all

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

Parameter

MIN

NOM

MAX

UNIT

Input voltage range

4.5

17

V

Output Voltage

0.6

12

V

Output current

8

A

Operating junction temperature

-40

150

°C

Switching Frequency (RT mode and PLL

mode)

200

1600

kHz

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

TPS54824

UNIT

RNV

18 PINS

Junction-to-ambient thermal resistance JEDEC

57.1

°C/W

Junction-to-ambient thermal resistance EVM

34

°C/W

Junction-to-case (top) thermal resistance

26.3

°C/W

Junction-to-board thermal resistance

18.8

°C/W

Junction-to-top characterization parameter

0.8

°C/W

Junction-to-board characterization parameter

18.8

°C/W

Junction-to-case (bottom) thermal resistance

1.2

°C/W