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AQY212GH Datasheet(PDF) 5 Page - Nais(Matsushita Electric Works) |
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AQY212GH Datasheet(HTML) 5 Page - Nais(Matsushita Electric Works) |
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5 / 6 page  AQY212GH 5 Cautions for Use SAFETY WARNINGS • Do not use the product under conditions that exceed the range of its specifications. It may cause overheating, smoke, or fire. • Do not touch the recharging unit while the power is on. There is a danger of electrical shock. Be sure to turn off the power when performing mounting, maintenance, or repair operations on the relay (including connecting parts such as the terminal board and socket). • Check the connection diagrams in the catalog and be sure to connect the terminals correctly. Erroneous connections could lead to unexpected operating errors, overheating, or fire. NOTES 1. Short across terminals Do not short circuit between terminals when relay is energized. There is possibility of breaking the internal IC. 2. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. 3. Recommended LED forward current (IF) It is recommended that the LED forward current (IF) be kept at 5mA. 4. Ripple in the input power supply If ripple is present in the input power supply, observe the following: 1) For LED operate current at Emin, maintain the value mentioned in the table of “Note 3. Recommended LED forward current (IF).” 2) Keep the LED operate current at 50 mA or less at Emax. 5. Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. 2) If spike voltages generated at the load are limited with a clamp diode and the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. 6. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning is used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. 1 2 4 3 Emin. Emax. 1 2 4 Load Add a clamp diode to the load Add a CR snubber circuit to the load Load 3 1 2 4 3 Cleaning solvent Compatibility (r: Yes !: No) Chlorine- base • Trichlene • Chloroethlene r Adueous • Indusco • Hollis • Lonco Terg r Alcohol- base • IPA • Ethanol r Others • Thinner • Gasoline ! 7. Soldering 1) When soldering PC board terminals, keep soldering time to within 10 s at 260 °C 500°F. 2) When soldering surface-mount terminals, the following conditions are recommended. (1) IR (Infrared reflow) soldering method (2) Vapor phase soldering method (3) Double wave soldering method T1 T2 T3 T1 = 155 to 165 °C 311 to 329°F T2 = 180 °C 200°C 356 to 392°F T3 = 245 °C 473°F or less t1 = 120 s or less t2 = 30 s or less t1 t2 T2 T1 t1 t2 T1 = 180 to 200 °C 366 to 392°F T2 = 215 °C 419°F or less t1 = 40 s t2 = 90 s or less T2 T1 t1 t2 t3 T1 = 155 to 165 °C 311 to 329°F T2 = 260 °C 500°F or less t1 = 60 s or less t2+t3 = 5 s or less (4) Soldering iron method Tip temperature: 280 to 300 °C 536 to 572 °F Wattage: 30 to 60 W Soldering time: within 5 s (5) Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.) • The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient temperature may increase excessively. Check the temperature under mounting conditions. • The conditions for the infrared reflow soldering apply when preheating using the VPS method. AQY212GH.fm5 y[W QOOQNU Sœ@˛jœ@ ªPQ QT“ |
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