VFH□1104P-TR

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Soldering condition

1.

Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on

heating method. Also, if components of varying shape are soldered together, it is recommended to set

the soldering pad temperature according to the component most vulnerable to heat (e.g., surface

mount LED).

2.

LED parts including the resin are not stable immediately after soldering ( when they are not at room

temperature), any mechanical stress may cause damage to the product. Please avoid such stress after

soldering, especially stacking of the boards which may cause the boards to warp and any other types

of friction with hard materials.

3.

Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin

surface. Temperature distribution varies on heating method, PCB material, other components in the

assembly, and mounting density.

Please do not repeat the heating process in Reflow process more than twice.

Notes 1 Temperature Profile for the reflow should be set to the surface temperature of resin which is on the

top of LED. This should be the maximum temperature for soldering. Lowering the heating temperature

and decreasing heating time is very effective in achieving higher reliability.

Notes 2 The reflow soldering process should be done up to twice(2 times Max). When second process is performed,

interval between first and second process should be as short as possible to prevent absorption of moisture

to resin of LED. The second soldering process should not be done until LEDs have returned to room

temperature (by nature-cooling) after first soldering process.

【Soldering Precaution】

(acc.to:EIAJ-4701/300)

【Recommended Reflow Soldering Condition】

40sec MAX.

150℃～180℃

+1.5～+5℃/s

260℃ MAX.

-1.5～-5℃/s

90~120sec MAX.

230℃ MAX.

Peak Temperature

2014/8/5

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