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TDP158I Datasheet(PDF) 6 Page - Texas Instruments |
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TDP158I Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 55 page  6 TDP158 SLLSEX2 – DECEMBER 2016 www.ti.com Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIH High-level input voltage at OE, A1/EQ2, A0/EQ1, TERM, I2C_EN, SLEW pins only 2.2 V High-level input voltage at SDA_SRC, SCL_SRC, SDA_CTL/PRE, SCL_CTL/SWAP 0.7 x VCC V High-level input voltage at SDA_SNK, SCL_SNK 2.9 V High-level input voltage at HPD 2 V VOL Low-level output voltage 0.4 V VOH High-level output voltage 2.4 V fSCL SCL clock frequency fast I2C mode for local I2C control 400 kHz C(bus,DDC) Total capacitive load for each bus line supporting 400 kHz (DDC terminals) 400 pF C(bus,I2C) Total capacitive load for each bus line (local I2C terminals) 100 pF dR(DDC) DDC Data rate 400 kbps IIH High level input current –30 30 µA IIM Mid level input current –20 20 µA IIL Low level input current –10 10 µA IOZ High impedance outpupt current 10 µA R(OEPU) Pull up resistance on OE pin 150 250 K Ω (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TDP158 UNIT RSB (WQFN) 40 PINS RθJA Junction-to-ambient thermal resistance 3.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 23.1 °C/W RθJB Junction-to-board thermal resistance 9.9 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 3.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.2 °C/W |
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