Specifications and information are subject to change without notice

WJ Communications, Inc

Phone 1-800-WJ1-4401 FAX: 408-577-6621

e-mail: sales@wj.com

Web site: www.wj.com

OCtober 2004

ECP203

2 Watt, High Linearity InGaP HBT Amplifier

Product Information

ECP203D (16-pin 4x4mm Package) Mechanical Information

Outline Drawing

Land Pattern

0.65mm

TYP.

TYP.

SOLDERMASK SWELL TO BE 0.5mm

FROM OUTSIDE EDGE OF ALL PADS

GROUND PLANE AREA FOR VIAS

2.23mm X 2.23mm

RECOMMENDED PAD

0.76mm X 0.34mm

DEVICE GROUND PAD

2.0mm X 2.0mm

4.00mm

16L 4.0mm X 4.0mm PACKAGE

0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED

ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP,

BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO

MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL,

VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE

PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE

EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN

REFLOW PROCESS

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

q C

17.5

q C / W

155

q C

Notes:

1. The thermal resistance is referenced from the junction-

to-case at a case temperature of 85 C. Tjc is a function

of the voltage at pins 10 and 11 and the current applied

to pins 10, 11, and 16 and can be calculated by:

Tjc = Tcase + Rth * Vcc * Icc

2. This corresponds to the typical biasing condition of +5V,

800 mA at an 85 C case temperature. A minimum

MTTF of 1 million hours is achieved for junction

temperatures below 247 C.

Product Marking

The component will be marked with an

“ ECP203D” designator with an alphanumeric

lot code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “ Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1B

Value:

Passes between 500 and 1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +235 C convection reflow

Standard:

JEDEC Standard J-STD-020

Functional Diagram

Function

Pin No.

Vref

1

RF Input

3

RF Output

10, 11

Vbias

16

GND

Backside Paddle

N/C or GND

2, 4-9, 12-15

Mounting Config. Notes

1.

A heatsink underneath the area of the PCB for the mounted

device is strictly required for proper thermal operation.

Damage to the device can occur without the use of one.

2.

Ground / thermal vias are critical for the proper performance

of this device. Vias should use a .35mm (#80 / .0135” )

diameter drill and have a final plated thru diameter of .25

mm (.010” ).

3.

Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

4.

Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

5.

Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

6.

RF trace width depends upon the PC board material and

construction.

7.

Use 1 oz. Copper minimum.

8

All dimensions are in millimeters (inches). Angles are in

degrees.

1

2

3

4

12

11

10

9

16

15

14

13

5

6

7

8

N/C

RF OUT

RF OUT

N/C

Vref

N/C

RF IN

N/C

MTTF vs. GNDTab Temperature

100

1000

10000

100000

60

70

80

90

100

110

120

TabTemperature(°C)