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LWY87C-S1T2-3K8L Datasheet(PDF) 14 Page - OSRAM GmbH

Part No. LWY87C-S1T2-3K8L
Description  white SMT package
Download  22 Pages
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Maker  OSRAM [OSRAM GmbH]
Homepage  http://www.osram.com
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 14 page
background image
2016-02-01
14
Version 2.2
LW Y87C
Recommended Solder Pad 8) page 21
Reflow soldering
Empfohlenes Lötpaddesign 8) Seite 21
Reflow-Löten
Note:
For superior solder joint connectivity results we
recommend soldering under standard nitrogen
atmosphere.
Package not suitable for ultra sonic cleaning.
Anm.:
Um eine verbesserte Lötstellenkontaktierung zu
erreichen, empfehlen wir, unter Standard-
Stickstoffatmosphäre zu löten.
Das Gehäuse ist für Ultraschallreinigung nicht
geeignet.
OHPY1315
0.8 (0.031)
Component location on pad
Bauteil positioniert
Padgeometrie fĂĽr
C
A
verbesserte Wärmeableitung
heat dissipation
Paddesign for improved
Lötstopplack
Solder resist
C
A




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