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LYM67K-J1L2-26 Datasheet(PDF) 11 Page - OSRAM GmbH

Part No. LYM67K-J1L2-26
Description  white SMT package
Download  20 Pages
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Maker  OSRAM [OSRAM GmbH]
Homepage  http://www.osram.com
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 11 page
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Version 1.2
LY M67K
2014-10-31
11
Recommended Solder Pad 9) page 19
Reflow soldering
Empfohlenes Lötpaddesign 9) Seite 19
Reflow-Löten
Note:
For superior solder joint connectivity results we
recommend soldering under standard nitrogen
atmosphere. Package not suitable for ultra
sonic cleaning.
Anm.:
Um eine verbesserte Lötstellenkontaktierung zu
erreichen, empfehlen wir, unter Standard-
Stickstoffatmosphäre zu löten. Das Gehäuse ist
für Ultraschallreinigung nicht geeignet.
OHLPY978
Paddesign
for improved
heat dissipation
Cu-area > 16 mm
Cu-Fläche > 16 mm
Wärmeableitung
Padgeometrie
für verbesserte
Lötstopplack
Solder resist
0.8 (0.031)
2.8 (0.110)
2
2
2.8 (0.110)
0.8 (0.031)




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