MC74LCX16245

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7

PACKAGE DIMENSIONS

TSSOP−48

DT SUFFIX

CASE 1201−01

ISSUE B

S

U

M

0.12 (0.005)

T

−V−

B

A

L

K

−U−

48X

REF

PIN 1

IDENT.

124

25

48

0.076 (0.003)

SEATING

D

−T−

PLANE

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

12.40

12.60

0.488

0.496

B

6.00

6.20

0.236

0.244

C

−−−

1.10

−−−

0.043

D

0.05

0.15

0.002

0.006

F

0.50

0.75

0.020

0.030

G

0.50 BSC

0.0197 BSC

H

0.37

−−−

0.015

−−−

J

0.09

0.20

0.004

0.008

J1

0.09

0.16

0.004

0.006

K

0.17

0.27

0.007

0.011

K1

0.17

0.23

0.007

0.009

L

7.95

8.25

0.313

0.325

M

0

8

0

8

__

__

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL

IN EXCESS OF THE K DIMENSION AT

MAXIMUM MATERIAL CONDITION.

5. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

6. DIMENSIONS A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

C

G

H

−W−

DETAIL E

J

K1

K

J1

SECTION N−N

M

0.25 (0.010)

F

DETAIL E

N

N

8.45

48X

0.32

0.50

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT

RECOMMENDED

48X

1.00

ON Semiconductor and

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MC74LCX16245/D

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