3

Package Dimensions, continued

HSMM-C110/C120/C170/C190/C150

Parameter

HSMN-C110/C120/C170/C190/C191/C150

Units

20

mA

Power Dissipation

78

mW

5

V

Led Junction Temperature

95

˚C

Operating Temperature Range

–40 to +85

˚C

Storage Temperature Range

–40 to +85

˚C

Soldering Temperature

See reflow soldering profile (Figure 7)

Note:

1. Derate linearly as shown in Figure 4.

Forward Voltage

Reverse Breakdown

Capacitance C

Thermal

Resistance

f = 1 MHz

R

Part Number

Typ.

Max.

Min.

Typ.

Typ.

HSMM-C110/C150

3.3

3.9

5

70

450

HSMN-C110/C150

3.3

3.9

5

70

450

HSMM-C120

3.3

3.9

5

45

450

HSMN-C120

3.3

3.9

5

45

450

HSMM-C170/C190

3.3

3.9

5

70

300

HSMN-C170/C190/C191

3.3

3.9

5

70

300

HSMx-C150

3.2 (0.126 )

0.5 (0.020)

0.50 ± 0.2

(0.020 ± 0.008)

0.6 (0.024)

POLARITY

CATHODE

MARK

1.1 (0.043)

0.50 ± 0.2

(0.020 ± 0.008)

2.0 (0.079)

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.6 (0.063)

CATHODE LINE

NOTES:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

HSMx-C191

1.6

(0.063 )

0.3 (0.012)

0.3 ± 0.15

(0.012 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.6 (0.023)

0.3 ± 0.15

(0.012 ± 0.006)

1.0

(0.039)

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINAL

0.8 (0.031)

CATHODE LINE

0.7 (0.028) MIN.