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DF52-8P-0.8C Datasheet(PDF) 5 Page - Hirose Electric |
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DF52-8P-0.8C Datasheet(HTML) 5 Page - Hirose Electric |
5 / 6 page 5 DF52 Series ●0.8mm Pitch, Compact and Robust Wire-to-Board Connectors BApplicable crimping tools Type Part No. HRS No. Applicable contact Remarks Applicator AP105-DF52-2832P 901-4636-7 DF52-2832PCF DHS877900H-UP − DF52-2832PCF (Note 2) Manufactured by Japan Automatic Machine Co.,Ltd. Press body CM-105C 901-0001-0 00 − Pull-out tool DF-C-PO(A) 550-0170-8 00 DF52-2832PCF Note 1 : Issues caused by using other than our specified tools are not covered by warranty. Note 2 : Please contact Japan Automatic Machine Co., Ltd. (hereinafter J.A.M.) through their website regarding defective crimping of adapting applicators manufactured by J.A.M. URL http://www.jam-net.co.jp BPrecautions 1. Recommended Temperature Profile (Compatible with lead- free soldering) [Applicable Conditions] 1. Peak temperature : 250℃ max. 2. Heating area : 220℃ min. for less than 60 seconds 3. Preheating area : 150℃ to 180℃ for 90 to 120 seconds 4. Number of times : no more than 2 times * Measurement is conducted at the contact lead part Soldering results may change depending on conditions such as solder paste type, manufacturer, PCB size, and other soldering materials. Please determine all mounting conditions before use. Note 1 : This temperature profile is a recommended value. 2. Recommended manual soldering conditions Temperature of soldering iron : 350±10℃, soldering time : within 3 seconds 3. Recommended screen thickness and aperture ratio (Pattern surface ratio) Thickness : 0.1mm, aperture opening ratio : 100% 4. Warpage of the Board A maximum of 0.02mm at the center of connector, as measured from either end of the connector 5. Cleaning Conditions IPA cleaning is allowed. (Cleaning is not recommended due to potential changes in mating action and other variables. Please contact us if you use other cleaning agents. ) 6. Noteworthy Points ■ Please note that any mating operation of the connector when not mounted on the board may cause damage or deformation of the contacts. ■ During hand soldering, do not apply flux, as it will flow over the connector. ■ This housing color may have slight variations depending on the production lot. This color variation does not affect performance. ■ Please refer to DF52 mating and unmating Procedure Document (ETAD-H0788) for points in handling regarding mating operations. ■ Please refer to Harness procedure manual (ETAD-H0791) for points in harness operations. 10sec MAX 90-120sec TIME (Sec) 200 150 0 100 250 MAX 250℃ 60sec MAX 180℃ 220℃ PRE-HEATING TIME SOLDERING TIME |
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