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DF50S-20DS-1C Datasheet(PDF) 11 Page - Hirose Electric |
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DF50S-20DS-1C Datasheet(HTML) 11 Page - Hirose Electric |
11 / 12 page 11 DF50 Series●1mm Pitch, Board to Wire Lock Connector 1.Recommended Temperature Profile (Compatible with lead-free soldering) [Applicable Conditions] 1.Peak temperature: a maximum of 250°C for no more than 10 seconds 2.Heating unit: no less than 220°C for no more than 60 seconds 3.Preheating unit: 150 to 180°C for 90 to 120 seconds 4.Number of times: no more than 2 times * Measurement is conducted at the contact lead part As it may change depending on the conditions such as solder paste types, manufacturers, PCB size, and other soldering materials, please fully check the mounting conditions before use. (Note 1) This temperature profile is a recommended value. 2.Recommended hand soldering conditions Temperature of soldering iron: 350±10°C, soldering time: 3 to 4 seconds 3.Recommended screen thickness and aperture ratio (Pattern surface ratio) Thickness: 0.1mm, aperture ratio: 100% 4.Warpage of the Board A maximum of 0.02mm at the center of connector, as measured from either end of the connector 5.Cleaning Conditions IPA cleaning is allowed. (Cleaning is not recommended because cleaning may change the push/pull feeling etc. Please contact us when you use other cleaning agents. ) 6.Precautions ▪ When inserting a crimp contact into a crimp socket, do not insert it at a slanted angle in order to maintain the reliability of its performance. ▪ Please refrain from pushing/pulling operation when the PCB is not mounted. It may cause breakage, contact deformation, etc. ▪ Please refrain from pushing/pulling operation with wires in your hand. It may cause damage. ▪During hand soldering, do not apply flux which will cause flux oozing on connector. ▪ This product may have a little difference in its molded color depending on the production lot, but the difference doesn't have any influence on the performance. ▪Please refer to the operation manual for more information. ▪Please refer to the documents "Cable assembly procedure", "Crimp condition"and "Crimp quality standards" for the cable assembly procedure. BPrecautions TIME (sec) 180℃ 100 150 200 250 220℃ PRE-HEATING TIME SOLDERING TIME MAX 250℃ 90 – 120sec 60secMAX 10secMAX 0 |
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